TCR-SWIT® uses SWIT® technology to guide airflow in cleanrooms, taking advantage of cool air sinking and warm air rising to keep conditions clean and at the right temperature for cleanrooms.
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(Patent No. 5361140, Patent No. 6636859, Patent No. 6878552, Patent No. 6909850, Patent No. 7068261, Patent No. 7311292, Patent No. 7332289, Patent No. 7332290, etc.)
Semiconductor cleanrooms require stable control of temperature, humidity, and contaminants to support ultrafine, high-yield processes. TCR-SWIT® applies SWIT® (a swirl-inducing, stratified HVAC method leveraging buoyancy of cool and warm air) to regulate temperature and cleanliness in cleanroom environments.
Features
Lowers energy use while preserving cleanroom cleanliness compared with conventional hybrid HVAC systems.
Maintains Class 1000 (@0.5 μm) / ISO 6 cleanliness requirements.
Cuts energy and installation costs for air-conditioning infrastructure (air transport, heat source) versus conventional hybrid systems.
Shaped vents send a large volume of cool air into the room as a swirling stream that mixes with the surrounding air. This lets the vents run at lower speeds and keeps the supply temperature closer to room temperature than in conventional setups. As air warms over heat sources, it rises and carries suspended particles to the ceiling, where they're removed—preserving the same cleanliness level as hybrid cleanroom systems.
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Comparison with conventional clean rooms with hybrid air conditioning systems
Comparison of FFU and TCR-SWIT® systems
